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Amphenol ICC, TactoTek Creating Automotive-Grade In-Mold Connector for Smart Surfaces

IMSE parts integrate printed electronics and electronic components within 3D injection molded plastics.

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By: Anthony Locicero

Copy editor, New York Post

TactoTek and Amphenol ICC (a division of Amphenol Corporation), a global manufacturer of interconnect products, announced that they are collaborating to develop automotive-grade in-mold connectors for TactoTek IMSE technology.
 
IMSE parts integrate printed electronics and electronic components within 3D injection molded plastics. They combine structure, electronic functions, and cosmetics in single piece, seamless smart surfaces. TactoTek IMSE parts often connect to external system electronics or host systems.
 
“Standardized in-mold connectors further simplify integrating IMSE smart surfaces in all types of products, whether vehicles, appliances or smart home solutions,” said Paavo Niskala, senior VP R&D at TactoTek. “In addition, the Amphenol MicroSpace connector enables high speed, automated IMSE production processes for faster cycle times and high yields.”
 
“By combining the technical expertise of TactoTek and Amphenol ICC, an innovative interconnect solution was created, which combines the compact LV214 severity-2 compatible MicroSpace connector family with the industry-proven Duflex crimp technology,” said Jerome Petit, Product Line manager at Amphenol ICC. “As a global leader in interconnect solutions, we continue to drive growth by accelerating transformational technologies like TactoTek’s IMSE with proven interconnect technology.”

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